top of page

Carbon nanomaterials

With the growth of nanoelectronics, the importance of thermal management in device packaging and the improvement of high-current-carrying interconnects/wires for avoiding the premature failure of devices have been emphasized. The heat and electrical transport properties of the bulk may not be valid in the characterization of a material at the nanometer level, because the phenomena that occur at the interfaces and grain boundaries become dominant. The failure mechanism of bulk metal interconnects has been understood in the context of electromigration;
however, in nanoscale materials, the effect of the heat dissipation that occurs at the nanointerfaces may play an important role.

In addition, Graphene was utilized for fabrication process, for example, a superficial layer in electroforming, off ering the required electrical conductivity and exhibiting the proper surface adhesion. This study eff ectively connects the electroforming process – aided by graphene – to the concept of fl exible electronic/optoelectronic devices and provides an approach for the practical implementation of a conducting line or frame in electronics packaging.

  • Growth of carbon nanomaterials: studies of the growth mechanism and control the dimensionality such as carbon nanotube (1D) and graphene (2D).  
     

  • Nanomaterials properties: studies of surface and charge transport properties at interface of carbon nanomaterials based heterostructures. 
     

  • Application of carbon nanomaterials: Heat sink, interconnect, electroforming process, field emission display, flexible electronic devices

OUR SPONSORS

Samsung-Electronics-logo-1030x467.gif
porous graphene copper

porous copper-metal composites

suspended graphene

Suspended graphene

joule heating from suspended graphene

Hot emission from suspended graphene arrays

porous graphene copper

Porous copper-graphene heat sink

electroforming

Graphene based electroforming process and flexible devices

CNT Cu fiber

Cross-section image of CNT-Cu fiber

bottom of page